According to @stocktalkweekly, AMKR and PLAB are straightforward beneficiaries of U.S. semiconductor reshoring with few direct domestic peers, forming a long thesis centered on policy-driven concessions and strategic positioning. source: X post by @stocktalkweekly dated Oct 3, 2025 Amkor (AMKR) is a leading outsourced semiconductor assembly and test provider and announced a new advanced packaging and test facility in Peoria, Arizona targeted to begin production in 2025, directly aligning with U.S. reshoring initiatives. source: Amkor Technology press release, Nov 2, 2023 The U.S. Department of Commerce launched the National Advanced Packaging Manufacturing Program under CHIPS for America with multi-billion-dollar funding to build domestic advanced packaging capacity, creating a policy tailwind for OSAT players such as AMKR. source: U.S. Department of Commerce, CHIPS for America NAPMP fact sheet, 2023 Photronics (PLAB) manufactures photomasks essential for lithography across IC and flat panel workflows, placing it as a critical upstream supplier during U.S. fab and packaging expansions. source: Photronics 2023 Form 10-K For crypto markets, increased U.S. packaging and photomask capacity could modestly improve long-run availability and lead times for compute and ASICs used in blockchain infrastructure, but near-term BTC mining hardware supply remains tied to Asian vendors, limiting immediate crypto impact. source: Marathon Digital Holdings 2023 Form 10-K; Riot Platforms 2023 Form 10-K Trading watch items: CHIPS Act award announcements, AMKR Arizona facility ramp milestones, and PLAB order trends linked to U.S. fab and advanced packaging investment cycles. source: U.S. Department of Commerce CHIPS for America program updates 2023–2024; Amkor Technology press release, Nov 2, 2023; Photronics 2023 Form 10-K

According to @stocktalkweekly, the quickest way for TSM or Apple to align with the Administration’s near-term made-in-America goals without waiting years for new wafer fabs is to route advanced packaging to a U.S.-based OSAT such as Amkor (AMKR) (source: @stocktalkweekly). Amkor has announced a new advanced packaging and test facility in Peoria, Arizona targeting production in 2025 to serve high-performance computing and other leading-edge customers, creating an immediate domestic path for assembly and test (source: Amkor Technology press release, Oct 2023). The CHIPS for America program explicitly prioritizes building U.S. advanced packaging capacity and makes assembly, test, and packaging projects eligible for incentives, which can steer orders onshore to qualified providers like Amkor (source: U.S. Department of Commerce, CHIPS for America NAPMP Vision 2022; CHIPS Incentives Program NOFO 2023). TSMC’s Arizona wafer fab ramp remains on a multiyear schedule with initial production shifted to 2025 and later phases further out, making domestic OSAT packaging a practical bridge for U.S. content while wafer capacity ramps (source: Reuters coverage of TSMC Arizona timeline, July 2023 and Dec 2023). Apple’s latest A‑series silicon relies on TSMC’s leading-edge nodes, so any packaging localization aligned to U.S. policy would intersect large U.S. OEM demand (source: Reuters, Sep 2023, on Apple A17 Pro using TSMC 3nm). The White House also increased tariffs on Chinese semiconductors in 2024, reinforcing incentives to localize parts of the supply chain in the U.S., though tariff outcomes ultimately depend on rules of origin and specific sourcing paths (source: The White House Fact Sheet, May 2024). For traders, potential U.S. OSAT wins tied to policy and customer mix are direct catalysts for AMKR’s revenue visibility and margins, while added advanced packaging capacity can ease known AI chip bottlenecks that previously constrained shipments, a tech risk-on impulse that often correlates with crypto market risk appetite (source: Reuters on CoWoS bottlenecks, Aug 2023; IMF blog on crypto–equity correlation, Jan 2022).